The diffusion rate of Co in Ge is found to be as fast as 2×10-6cm2s-1
at 900 °C, whereas the Co solubility comes close to 1×1016cm-3
at the same temperature. Based on these properties and its acceptor activity,
Co may cause serious contamination problems during the fabrication of Ge-based
electronic devices. In contrast to an early radiotracer study, we observe
common diffusion profiles of complementary error function type, which are
indicative of a constant diffusivity depending only on temperature. A
preliminary analysis of the data points to the dissociative diffusion mechanism
involving interstitial–substitutional exchange via vacancies. However, in
contrast to Cu, which migrates via the vacancy-controlled mode of the
dissociative mechanism, the diffusion of Co may be rate-limited by the
transport properties of its interstitial modification (Coi).
Source: Physica B: Condensed Matter
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