Single-crystal germanium layers grown on silicon by nanowire seeding

Three-dimensional integration and the combination of different material systems are central themes of electronics research. Recently, as-grown vertical one-dimensional structures have been integrated into high-density three-dimensional circuits. However, little attention has been paid to the unique structural properties of germanium nanowires obtained by epitaxial and heteroepitaxial growth on Ge(111) and Si(111) substrates, despite the fact that the integration of germanium on silicon is attractive for device applications. Here, we demonstrate the lateral growth of single crystal germanium islands tens of micrometres in diameter by seeding from germanium nanowires grown on a silicon substrate. Vertically aligned high-aspect-ratio nanowires can transfer the orientation and perfection of the substrate crystal to overlying layers a micrometre or more above the substrate surface. This technique can be repeated to build multiple active device layers, a key requirement for the fabrication of densely interconnected three-dimensional integrated circuits.

• Source:Scienece
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Slicing, cleaning and kerf analysis of germanium wafers machined by wire electrical discharge machining

This paper investigates the slicing of germanium wafers from single crystal, gallium-doped ingots using wire electrical discharge machining. Wafers with a thickness of 350 μm and a diameter of 66 mm were cut using 75 and 100 μm molybdenum wire. Wafer characteristics resulting from the process such as the surface profile and texture are analyzed using a surface profiler and scanning electron microscopy. Detailed experimental investigation of the kerf measurement was performed to demonstrate minimization of material wastage during the slicing process using WEDM in combination with thin wire diameters. A series of timed etches using two different chemical etchants were performed on the machined surfaces to measure the thickness of the recast layer. Cleaning of germanium wafers along with its quality after slicing is demonstrated by using Raman spectroscopy.

Keywords

• Wire electrical discharge machining; 
• Wafer slicing; 
• Single crystal germanium; 
• Raman spectroscopy; 
• Kerf; 
• Wafer cleaning; 
• Recast layer thickness
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    • Source:Scienece
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    • For more information, please visit our website:www.powerwaywafer.com, send us email at sales@powerwaywafer.com  or powerwaymaterial@gmail.com