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Picosecond laser cutting of fragile 150 μm thin germanium wafers (typically used for solar cell applications) in liquid results in debris-free surfaces
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Liquid-assisted laser cutting is much better than air-assisted laser cutting in terms of recast, debris and cleanness of the resultant grooves
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Laser cutting in ethanol-water mixtures result in better cut quality than those performed in pure water but lead to less cutting efficiency
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Low repetition rate (10 kHz), mixed solution (1wt% ethanol in water) and moderate scanning speed (100 μm/s) are preferable for ultrafine high-quality debris-free cutting
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