Feb 4, 2016

Debris-Free Rear-Side Picosecond Laser Ablation of Thin Germanium Wafers in Water with Ethanol


Picosecond laser cutting of fragile 150 μm thin germanium wafers (typically used for solar cell applications) in liquid results in debris-free surfaces
Liquid-assisted laser cutting is much better than air-assisted laser cutting in terms of recast, debris and cleanness of the resultant grooves
Laser cutting in ethanol-water mixtures result in better cut quality than those performed in pure water but lead to less cutting efficiency
Low repetition rate (10 kHz), mixed solution (1wt% ethanol in water) and moderate scanning speed (100 μm/s) are preferable for ultrafine high-quality debris-free cutting


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